High Efficiency Cooling BGA Reballing Stencil Templates for IC Chip Reballing Prevent Overheating for CYW20734UA1KFFB3G

Features: This versatile Reballing Stencil supports for CPU IC chips such as for NFCBEA, BCM4354, MAX77620A, eliminating the need for separate templates and streamlining repair setups. Featuring precise hole alignment for accurate soldering and crafted from durability plastic, this stencil ensures reliability performances, lightweight portability, and longevity. Ideal for professional electronic repair technicians and enthusiasts, it caters to users requiring efficient tools for chip maintenance and repairs. Designed for convenient use in various environments, including home workshops and mobile repair stations, it facilitates seamless chip reballing tasks on components like for BGA200 and CYW20734UA1KFFB3G. With enhanced heat dissipation properties, this stencil prevents overheating during prolonged soldering , safeguarding sensitive chips and ensuring stable operate.

Specifications: Component: plastic Reballing Stencil for chip: 0.12MM ODNX02A2:0.20MM Option Type:for chip,for ODNX02A2 Compatible for CPU IC chip Suitable for electronic repair and welding heavy ball operations, especially the maintenance and repair of game console related chips;

Package Includes: 1pc Reballing Stencil

note: Please allow 1-3cm errors due to manual measurement. Due to the differences between different monitors, the picture may not reflect the actual item color.